Silicon substrate ringing in microfabricated ultrasonic transducers

Author

Ladabaum, Igal ; Wagner, Paul ; Zanelli, Claudio ; Mould, John ; Reynolds, Paul ; Wojcik, Greg

Author_Institution

Sensant Corp., San Jose, CA, USA

Volume

1

fYear

2000

fDate

36800

Firstpage

943

Abstract

Experimental and theoretical evidence of silicon substrate ringing in microfabricated ultrasonic transducers is presented. This ringing is clearly observed in immersion transducers with a 650 μm thick substrate at 7 MHz and harmonics. An analytical model of the ringing is introduced, and simulations based on the model are shown to agree with experimental observation. Experimental results are further compared to simulations carried out in time-domain, large-scale PZFlex models and qualitative agreement is demonstrated. The insights gained from the simulations and experiments are used to design and fabricate a device whose ringing mode is eliminated with a backing layer

Keywords

elemental semiconductors; harmonics; micromachining; silicon; substrates; time-domain analysis; ultrasonic transducers; 650 mum; 7 MHz; Si; Si substrate ringing; analytical model; backing layer; design; harmonics; immersion transducers; large-scale PZFlex models; microfabricated ultrasonic transducers; model; ringing mode; simulations; time-domain; Analytical models; Circuit simulation; Electrodes; Equivalent circuits; Frequency; Large-scale systems; Resonance; Silicon; Time domain analysis; Ultrasonic transducers;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 2000 IEEE

Conference_Location

San Juan

ISSN

1051-0117

Print_ISBN

0-7803-6365-5

Type

conf

DOI

10.1109/ULTSYM.2000.922696

Filename

922696