MediaTek´s R&D in microwaves

In this paper, novel antenna design concepts and chip-package-board co-design methodology are shown to demonstrate MediaTek´s R&D activities in microwave. Various antenna technologies of broadband, low HAC (hearing-aid compatibility), and higher efficiency are developed for better OTA (over-the-air) performance. A co-design methodology, which integrates the aggressor, victim, and coupling path model into a single platform, is also presented to deal with system level desensitization problems in system-on-chip (SoC) and system-in-package (SiP) designs. With these key design considerations and methodology, MediaTek provides a reliable platform with good wireless performance guaranteed, and keeps being the pioneer in the microwave research and industry.