DocumentCode
3098745
Title
2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167)
fYear
2001
fDate
April 30 2001-May 3 2001
Abstract
The following topics were covered: product reliability; process and reliability interactions; MEMS reliability characterisation; packaging and assembly; oxide; wafer level reliability for interconnects; optoelectronics and compound semiconductors; ESD/latchup; failure analysis; process induced damage; interconnect reliability; hot carriers
Keywords
assembling; electrostatic discharge; failure analysis; hot carriers; integrated circuit interconnections; micromechanical devices; optoelectronic devices; packaging; reliability; ESD; MEMS reliability characterisation; assembly; compound semiconductors; failure analysis; hot carriers; interconnect reliability; latchup; optoelectronics; oxide layers; packaging; process induced damage; process/reliability interactions; product reliability; wafer level reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2001. Proceedings. 39th Annual. 2001 IEEE International
Conference_Location
Orlando, FL, USA
Print_ISBN
0-7803-6587-9
Type
conf
DOI
10.1109/RELPHY.2001.922871
Filename
922871
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