• DocumentCode
    3099173
  • Title

    Finite element analysis of mechanically amplified CMUTs

  • Author

    Unger, Alexander ; Hoffmann, Marco ; Min-Chieh Ho ; Kwan Kyu Park ; Khuri-Yakub, Butrus T. ; Kupnik, Mario

  • Author_Institution
    Brandenburg Univ. of Technol., Cottbus, Germany
  • fYear
    2013
  • fDate
    21-25 July 2013
  • Firstpage
    287
  • Lastpage
    290
  • Abstract
    We introduce the possibility of improving a single-cell capacitive micromachined ultrasonic transducer (CMUT) for air-coupled ultrasound by simply adding a hollow conical-shaped structure (horn) on top of the CMUT plate. The main objective is to improve both transmit and receive sensitivity by lowering the center-to-average displacement ratio, which for bending plate operated devices inherently is limited. In addition, for receive mode the force generated from the impinging sound pressure wave is concentrated to the center of the plate, resulting in larger signals and, in contrast to piston-shaped plates, the horn has the advantage of only moderately increasing the modal mass of the structure. By using finite element analysis and first sound pressure measurements of our modified CMUT, we demonstrate that this idea is feasible and promising for air-coupled CMUTs operating at frequencies below 150 kHz, as it has been been proven to be successful for commercially available piezoelectric-driven bending plate devices as well.
  • Keywords
    acoustic signal processing; bending; finite element analysis; piezoelectric transducers; plates (structures); structural acoustics; ultrasonic transducers; air-coupled CMUT; air-coupled ultrasound; bending plate; center-average displacement ratio; finite element analysis; first sound pressure measurements; hollow conical-shaped structure; impinging sound pressure wave; mechanically amplified CMUT plate; modal mass; piezoelectric-driven bending plate devices; piston-shaped plates; receive mode; receive sensitivity; single-cell capacitive micromachined ultrasonic transducer; transmit sensitivity; Acoustics; Aluminum; Finite element analysis; Frequency measurement; Silicon; Ultrasonic transducers; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2013 IEEE International
  • Conference_Location
    Prague
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-5684-8
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2013.0074
  • Filename
    6725171