DocumentCode
3099788
Title
Experimental study of gate voltage scaling for TDDB under direct tunneling regime
Author
Takayanagi, Mariko ; Takagi, Shin-ichi ; Toyoshima, Yoshiaki
Author_Institution
Syst. LSI Res. & Dev. Center, Toshiba Corp., Yokohama, Japan
fYear
2001
fDate
2001
Firstpage
380
Lastpage
385
Abstract
Systematic experiments of time-to-breakdown (TBD) of thin gate oxides are carried out in this paper for quantitative understanding of gate voltage scaling for TDDB under the direct tunneling regime. It is found that the slope of ln TBD has a nonlinear relationship to gate oxide voltage, Vox, and thus, the conventional constant voltage acceleration model is not applicable for lifetime prediction. A simple model to explain the experimental voltage acceleration factor is proposed based on the anode hole injection (AHI) concept. It is shown that the significant decrease in hole generation due to lowering of the electron energy injected to the anode greatly helps the TDDB reliability
Keywords
MOS capacitors; MOSFET; dielectric thin films; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; semiconductor device testing; tunnelling; CMOSFETs; MOS capacitors; SiO2-Si; TDDB; TDDB reliability; anode hole injection; constant voltage acceleration model; direct tunneling regime; electron energy injection; gate oxide voltage; gate voltage scaling; hole generation; lifetime prediction; thin gate oxides; time-to-breakdown; voltage acceleration factor; Acceleration; Anodes; Breakdown voltage; Charge carrier processes; Dielectric breakdown; Laboratories; Large scale integration; Predictive models; Stress; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2001. Proceedings. 39th Annual. 2001 IEEE International
Conference_Location
Orlando, FL
Print_ISBN
0-7803-6587-9
Type
conf
DOI
10.1109/RELPHY.2001.922930
Filename
922930
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