• DocumentCode
    3102106
  • Title

    Optimal heat transfer criterion and inclination angle effects on non-boiling regime spray cooling

  • Author

    Guo, Yong-xian ; Zhou, Zhi-fu ; Jia, Jian-yuan ; Zhou, Shao-rong

  • Author_Institution
    Sch of Mechano-Electron. Engingeering, Xidian Univ, Xi´´an
  • fYear
    2009
  • fDate
    15-19 March 2009
  • Firstpage
    193
  • Lastpage
    200
  • Abstract
    Based on the maximum CHF (critical heat flux) criterion, an optimal heat transfer criterion, which is called H criterion, was proposed. Experimental apparatuses were conducted. Distilled water was used as the working fluid. Three different DANFOSS nozzles with cone angles being 54deg, 50deg and 54deg respectively were used to cool a 30times30 mm2 square copper surface. Experimental results indicated that the volumetric fluxes were pro-portioned to P0.5, where P is the pressure drop across the nozzles. The optimal distance between the nozzles and the heated surface were derived. The results indicated that the optimal heat transfer appeared while the outside of the impellent thin spray film inscribed in the square heated surface. Based on the H criterion aforementioned, two DANFOSS nozzles of the three were used to study the temperature distribution of the heated surface experimentally while there were spray inclination angles. Distilled water was also used impacting on the 30times30 mm2 square copper surface aforementioned and a circular heated copper surface with diameters being 30 mm respectively. The heat flux of the surface was kept in constant (about 26-35 W/cm2). The inclination angles were 0deg, 10deg, 20deg, 30deg, 40deg and 50deg respectively. Experimental results indicated that the grads of the temperature of the surface increases first and then decreases with the increase of the inclination angle.
  • Keywords
    cooling; nozzles; thermocouples; DANFOSS nozzles; critical heat flux; distilled water; inclination angle effects; non boiling regime spray cooling; optimal heat transfer criterion; volumetric fluxes; Coolants; Copper; Electronics cooling; Heat engines; Heat transfer; Space exploration; Spraying; Temperature; Uncertainty; Water heating; CHF; Inclination; Optimal distance; Spray cooling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4244-3664-4
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2009.4810763
  • Filename
    4810763