A test board for multiport immittance measurement and characterization of RF-IC packages

Author

Tripathi, Anand ; Lutz, Robert ; Tripathi, V.K.

Author_Institution

Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA

Volume

3

fYear

1998

fDate

7-12 June 1998

Firstpage

1921

Abstract

An experimental technique based on the measurement of two port scattering parameters for the characterization of electrically small RF-IC package is presented. The procedure is based on a novel test board design to facilitate extraction of n-port admittance and impedance matrix parameters using two port network analyzer scattering parameter measurements. An optimization routine is used to extract the SPICE based equivalent circuit model that includes the mutual coupling effects present in the RF-IC package pins.

Keywords

S-parameters; SPICE; electric immittance measurement; equivalent circuits; integrated circuit packaging; integrated circuit testing; network analysers; two-port networks; RF-IC package; SPICE equivalent circuit model; admittance matrix; impedance matrix; multiport immittance measurement; mutual coupling; optimization; test board; two port network analyzer scattering parameter measurement; Admittance measurement; Circuit testing; Electric variables measurement; Equivalent circuits; Impedance measurement; Mutual coupling; Packaging; Pins; SPICE; Scattering parameters;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1998 IEEE MTT-S International

Conference_Location

Baltimore, MD, USA

ISSN

0149-645X

Print_ISBN

0-7803-4471-5

Type

conf

DOI

10.1109/MWSYM.1998.700957

Filename

700957