DocumentCode
3106334
Title
Evaluation of Sleeping Comfort of Bed Mattresses with Different Elastic Moduli for Each Body Region
Author
Aoi, Mikio ; Hashimoto, Koji ; Yoshida, Hiroyuki ; Kamijo, Masayoshi
Author_Institution
Shinshu Univ., Nagano, Japan
fYear
2013
fDate
5-7 July 2013
Firstpage
137
Lastpage
142
Abstract
The purpose of this study is to create a method for evaluating the quality of sleep depending on the elastic property of the bed mattress by measuring physiological and psychological responses while sleeping. We executed POMS (Profile of Mood States) before and after sleep, and investigated the change in subjects´ moods according to sleep. We prepared bed mattresses that have different elasticity moduli for each body region respectively and 2 bed mattresses. All mattresses are composed of the pocket coil system. We measured the PSG and Actigraph of subjects while sleeping in each bed mattress so that the quality of sleep can be estimated. The PSG is a comprehensive recording of the biophysiological changes that occur during sleep. The Actigraph is a comprehensive recording of the body movements that occur during sleep. As a result, the sleep depth on a bed mattress with high degree of elasticity became deep as shown by the evaluation using PSG and Actigraph. We concluded that there is a posture suitable for sleeping from this experiment.
Keywords
biomechanics; biomedical equipment; coils; elastic moduli; elasticity; electro-oculography; electroencephalography; neurophysiology; psychology; sleep; PSG measurement; actigraph measurement; bed mattress; biophysiological change recording; body movement; elastic moduli; physiological response measurement; pocket coil system; polysomnography; profile of mood state; psychological response measurement; sleep quality evaluation; sleeping comfort evaluation; Coils; Elasticity; Electrodes; Mood; Physiology; Sleep; Actigraph; Bed Mattress; Polysomnography (PSG); Profile of mood states: POMS; Sleeping comfort;
fLanguage
English
Publisher
ieee
Conference_Titel
Biometrics and Kansei Engineering (ICBAKE), 2013 International Conference on
Conference_Location
Tokyo
Type
conf
DOI
10.1109/ICBAKE.2013.28
Filename
6603490
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