DocumentCode
3108723
Title
Packaging for wireless technology
Author
Monthei, D.
Author_Institution
TriQuint Semicond. Inc., Hillsboro, OR, USA
fYear
1997
fDate
12-15 Oct. 1997
Firstpage
33
Lastpage
36
Abstract
This paper discusses some of the typical packages being used for wireless applications today and how they are "modified" for high frequency use. Also discussed are electrical modeling concerns of packages, PC board layout and a number of other factors impacting part performance. Choices in parasitic circuit topology are discussed along with EM simulation and comparison to measured data.
Keywords
code division multiple access; digital radio; packaging5801694; radio equipment; EM simulation; PC board layout; electrical modeling; high frequency performance; packaging; parasitic circuit topology; wireless technology; Automation; Ceramics; Circuit simulation; Costs; Frequency; MMICs; Plastic packaging; Semiconductor device packaging; Sockets; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1997. Technical Digest 1997., 19th Annual
Conference_Location
Anaheim, CA, USA
ISSN
1064-7775
Print_ISBN
0-7803-4083-3
Type
conf
DOI
10.1109/GAAS.1997.628231
Filename
628231
Link To Document