A study on electromagnetic coupling between transmission line on model chip

Author

Kayano, Yoshiki ; Inoue, Hiroshi

Author_Institution

Dept. of Electr. & Electron. Eng., Akita Univ., Akita

fYear

2008

fDate

18-22 Aug. 2008

Firstpage

1

Lastpage

5

Abstract

To clarify the electromagnetic compatibility (EMC) problems that related to the interconnection in the integrated circuit (IC) chip, transmission characteristics and electromagnetic coupling between wirings in the specially designed model transmission lines in IC chip were investigated. At first, model transmission lines, designed on the bear chip with the size of 4800 mum square, were created as model parallel transmission lines with straight, right angle and bending lines. The measurement methods, usually used for transmission line on the printed circuit board, are applied to the sample IC. It was demonstrated that decrease of transmission coefficient and dramatically large far-end cross-talk enough to cause serious errors arise at gigahertz frequency band.

Keywords

crosstalk; electromagnetic compatibility; electromagnetic coupling; integrated circuit interconnections; transmission lines; electromagnetic compatibility problems; electromagnetic coupling; gigahertz frequency band; integrated circuit chip interconnection; large far-end crosstalk; parallel transmission lines; printed circuit board; transmission coefficient; Distributed parameter circuits; Electromagnetic compatibility; Electromagnetic coupling; Electromagnetic modeling; Frequency measurement; Integrated circuit interconnections; Integrated circuit modeling; Transmission line measurements; Transmission lines; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on

Conference_Location

Detroit, MI

Print_ISBN

978-1-4244-1699-8

Electronic_ISBN

978-1-4244-1698-1

Type

conf

DOI

10.1109/ISEMC.2008.4652063

Filename

4652063