• DocumentCode
    3115196
  • Title

    Multiconductor transmission line modeling with VHDL-AMS for EMC applications

  • Author

    Zhang, H. ; Siebert, K. ; Frei, S. ; Wenzel, T. ; Mickisch, W.

  • Author_Institution
    Dortmund Univ. of Technol., Dortmund
  • fYear
    2008
  • fDate
    18-22 Aug. 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A multiconductor transmission line (MTL) model for the time domain considering losses, incident fields and skin-effects for the modeling language VHDL-AMS was developed. The model is based on the FDTD method. It can be extended by various VHDL-AMS circuit files and used for linear and non-linear time domain simulations. Modern standardized modeling languages like VHDL-AMS have the important advantage that growing model libraries permit fast creation of large simulation models. Exchange of models and extension of models is easily possible. After a short introduction to VHDL-AMS and presentation of the MTL- and FDTD-theory used for modeling, examples are shown. The developed model is compared to calculation results gained with other simulation methods. The validity of the implemented VHDL-AMS model is proved.
  • Keywords
    electrical engineering computing; electromagnetic compatibility; finite difference time-domain analysis; hardware description languages; multiconductor transmission lines; skin effect; EMC applications; FDTD method; VHDL-AMS; incident fields; linear time domain simulations; multiconductor transmission line modeling; nonlinear time domain simulations; skin-effects; Automotive engineering; Circuit simulation; Digital systems; Electromagnetic compatibility; Electromagnetic fields; Finite difference methods; Libraries; Multiconductor transmission lines; Power cables; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
  • Conference_Location
    Detroit, MI
  • Print_ISBN
    978-1-4244-1699-8
  • Electronic_ISBN
    978-1-4244-1698-1
  • Type

    conf

  • DOI
    10.1109/ISEMC.2008.4652114
  • Filename
    4652114