• DocumentCode
    3116023
  • Title

    Progress in the development of a 2D Feature Selective Validation (FSV) method

  • Author

    Orlandi, A. ; Antonini, G. ; Polisini, C. ; Duffy, A. ; Sasse, H.

  • Author_Institution
    EMC Lab., Univ. of L´´Aquila, L´´Aquila
  • fYear
    2008
  • fDate
    18-22 Aug. 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The feature selective validation (FSV) technique is becoming a favored approach to quantifying the comparison of numerical and / or experimental data for validation purposes. It is a heuristic approach and, therefore, has scope for developments, enhancements and refinements from researchers particularly interested in formal validation, particularly of computational electromagnetics. One area that is clearly ripe for development is in extending the current dasiaFSVpsila FSV approach to two or more independent axes, for example to compare surface currents over a whole body. As the central tenet of FSV is to mirror the perceptions of a group of experts, higher levels of dimensionality provide substantial challenges for calibration. However, a first step in this development is gaining experience and understanding of the quantification of multidimensional data. Building on previous work, this paper concludes with a set of recommendations for the full development of two dimensional FSV.
  • Keywords
    computational electromagnetics; feature extraction; 2D feature selective validation method; computational electromagnetics; heuristic approach; multidimensional data quantification; Computational electromagnetics; Decision making; Electromagnetic compatibility; Mirrors; Performance evaluation; Process design; Sensitivity analysis; Statistical analysis; Statistics; Testing; FSV; Feature Selective Validation; comparison; measurement; modeling; validation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
  • Conference_Location
    Detroit, MI
  • Print_ISBN
    978-1-4244-1699-8
  • Electronic_ISBN
    978-1-4244-1698-1
  • Type

    conf

  • DOI
    10.1109/ISEMC.2008.4652156
  • Filename
    4652156