DocumentCode
3116284
Title
Enhancing the lifetime prediction methodology for photovoltaic modules based on electronic packaging experience
Author
Guyenot, M. ; Peter, E. ; Zerrer, P. ; Kraemer, F. ; Wiese, S.
Author_Institution
BOSCH GmbH, Schwieberdingen, Germany
fYear
2011
fDate
18-20 April 2011
Firstpage
42373
Lastpage
42464
Abstract
Photovoltaic modules as well as automotive electronics are both designed to perform more than 20 years in the field. They show many similarities, for example the material combinations (Silicon, copper, lead free interconnection), the field loads, qualification tests, etc. Therefore knowledge obtained from designing automotive electronics can be used to design reliable photovoltaic modules. In the recent years many lifetime prediction methods have been developed to address a variety of different damage mechanisms observed in the field such as crack growth, delamination etc. by simulation. The paper describes various aspects of how the experiences gained in this field of research can be transferred to photovoltaic modules. In order to show a first application of the discussed issues, selected optimization measures on the basis of numerical results for photovoltaic modules on tabber stringer technology will be presented.
Keywords
electronics packaging; remaining life assessment; solar cells; automotive electronics; crack growth; delamination; electronic packaging experience; lifetime prediction methodology; photovoltaic modules; tabber stringer technology; Automotive engineering; Copper; Glass; Laminates; Lead; Packaging; Robustness;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location
Linz
Print_ISBN
978-1-4577-0107-8
Type
conf
DOI
10.1109/ESIME.2011.5765781
Filename
5765781
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