DocumentCode
3116386
Title
Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests
Author
Pufall, R. ; Goroll, M. ; Mahler, J. ; Kanert, W. ; Bouazza, M. ; Wittler, O. ; Dudek, R.
Author_Institution
Infineon Technol. AG, Neubiberg, Germany
fYear
2011
fDate
18-20 April 2011
Firstpage
42374
Lastpage
42495
Abstract
High temperature storage can degrade moulding compounds for chip encapsulation to such an extent that the adhesion to surfaces like copper (lead frames) or polyimide (chip coating) decreases drastically causing delamination. Also during normal operation of electronic components heat is generated locally (bond wire or chip surface) degrading the moulding compound and reducing the adhesion which in extreme cases can destroy the metallisation or the bond wires.
Keywords
adhesion; delamination; metallisation; moulding; adhesion; bond wire; button shear test; chip encapsulation; delamination; electronic component heat; metallisation; moulding compound; stress test; Adhesives; Compounds; Copper; Force; High temperature superconductors; Materials reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location
Linz
Print_ISBN
978-1-4577-0107-8
Type
conf
DOI
10.1109/ESIME.2011.5765786
Filename
5765786
Link To Document