DocumentCode
3117695
Title
Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies
Author
Vandevelde, B. ; Labie, R. ; Cherman, V. ; Webers, T. ; Winters, C. ; Beyne, E. ; Dosseul, Franck
Author_Institution
imec, Leuven, Belgium
fYear
2011
fDate
18-20 April 2011
Firstpage
42375
Lastpage
42527
Abstract
Two different flip chip bump configurations have been investigated in terms of their thermo-mechanical, electromigration and fusing behaviour. Standard SAC (SnAgCu) solder bumps with a Ni/Au finish on the chip side are compared with Cu pillar bumps soldered with a thin layer of SnAg alloy. For the test structure, the flip chip assembly is integrated in a BGA package. Finite Element Modelling is used to support the experimental work and explain some of the conclusions.
Keywords
ball grid arrays; electromigration; flip-chip devices; gold; nickel; silver alloys; solders; tin alloys; BGA package; Ni-Au; SnAgCu; electromigration; finite element modelling; fuse performance; pillar flip chip assemblies; standard solder bumps; thermomechanical performance; Atmospheric measurements; Copper; Finite element methods; Glass; Mechanical variables measurement; Particle measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location
Linz
Print_ISBN
978-1-4577-0107-8
Type
conf
DOI
10.1109/ESIME.2011.5765847
Filename
5765847
Link To Document