DocumentCode
3119989
Title
Polyimide planarization for RF-MEMS switches on PCB
Author
Ghodsian, Bahram ; Jung, C. ; Cetiner, B.A. ; De Flaviis, F.
Author_Institution
Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
fYear
2004
fDate
24-27 Oct. 2004
Firstpage
605
Abstract
This abstract describes an improved manufacturing technology for fabrication of RF-MEMS switches on PCB. The 17.5 μm thick copper layer is patterned and planarized using polyimide. The use of polyimide reduces formation of voids in sacrificial photoresist. Fabricated switches demonstrate low insertion-loss (<0.06 dB at 10 GHz) and good isolation (>20 dB at 10 GHz).
Keywords
copper; isolation technology; losses; microswitches; microwave switches; photoresists; planarisation; polymer films; printed circuits; 10 GHz; 17.5 micron; Cu; PCB; RF-MEMS switches; insertion-loss; isolation; manufacturing technology; patterned copper layer; polyimide planarization; sacrificial photoresist voids; voids; Antenna accessories; Copper; Dielectric losses; Isolation technology; Planarization; Polyimides; Radio frequency; Radiofrequency microelectromechanical systems; Resists; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2004. Proceedings of IEEE
Print_ISBN
0-7803-8692-2
Type
conf
DOI
10.1109/ICSENS.2004.1426238
Filename
1426238
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