Preliminary Study of the Thermal Impact of a Microelectrode Array Implanted in the Brain

Author

Kim, Sohee ; Normann, Richard A. ; Harrison, Reid ; Solzbacher, Florian

Author_Institution

Dept. of Electr. & Comput. Sci., Utah Univ., Salt Lake City, UT

fYear

2006

fDate

Aug. 30 2006-Sept. 3 2006

Firstpage

2986

Lastpage

2989

Abstract

One requirement of a chronically implantable, wireless neural interface device is the integration of electronic circuitry with the microelectrode array. Since the electronic IC dissipates a certain amount of power, it will affect the temperature in the tissues surrounding the implant site. In this paper, the thermal influence of an integrated, 3-dimensional Utah electrode array, to be implanted in the brain was investigated with simulations using the finite element method (FEM). A temperature increase in the brain tissue was predicted using preliminary simulations with simplified models. The model and method used in the simulations were verified by simple in vitro experiments

Keywords

arrays; bioelectric phenomena; biomedical electrodes; biomedical electronics; biomedical measurement; biothermics; finite element analysis; integrated circuits; microelectrodes; neurophysiology; physiological models; FEM model; brain tissues temperature; electronic IC; electronic circuitry; finite element method; in vitro experiments; integrated 3-dimensional Utah electrode array; microelectrode array implantation; neural recording; thermal impact; wireless neural interface device; Brain modeling; Circuits; Cities and towns; Electrodes; Finite element methods; Heat transfer; Implants; Microelectrodes; Temperature; USA Councils;

fLanguage

English

Publisher

ieee

Conference_Titel

Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE

Conference_Location

New York, NY

ISSN

1557-170X

Print_ISBN

1-4244-0032-5

Electronic_ISBN

1557-170X

Type

conf

DOI

10.1109/IEMBS.2006.260307

Filename

4462424