DocumentCode
3123105
Title
CMOS compatible 3-D self assembled microstructures using thin film SOI technology
Author
Iker, F. ; Moussa, M. Si ; André, N. ; Pardoen, T. ; Raskin, J.P.
Author_Institution
CeRMiN, Univ. Catholique de Louvain, Louvain-la-Neuve, Belgium
fYear
2004
fDate
24-27 Oct. 2004
Firstpage
1113
Abstract
3D self-assembled microstructures are processed based on thin film SOI wafers. Self assembled structures going from meander inductors to flow sensors are obtained from using only one photolithographic step. The assembly of our microstructures relies on the thermal expansion mismatch between the material layers as well as control of the plastic flow of one of the layers.
Keywords
flow measurement; microactuators; micromechanical devices; microsensors; multilayers; photolithography; plastic flow; self-assembly; silicon-on-insulator; thermal expansion; thin film inductors; 3D self assembled MEMS; CMOS compatible microstructures; flow sensors; layer plastic flow; material layer thermal expansion mismatch; meander inductors; microactuators; microsensors; multilayered structures; single photolithographic step processing; thin film SOI technology; CMOS technology; Fabrication; Grain boundaries; Inductors; Microstructure; Nonhomogeneous media; Semiconductor films; Thermal expansion; Thermal stresses; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2004. Proceedings of IEEE
Print_ISBN
0-7803-8692-2
Type
conf
DOI
10.1109/ICSENS.2004.1426371
Filename
1426371
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