• DocumentCode
    3124048
  • Title

    Optical Through-Wafer Interconnects for 3D Hyper-Integration

  • Author

    Thacker, H. ; Ogunsola, O. ; Carson, A. ; Bakir, M. ; Meindl, J.

  • Author_Institution
    Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA
  • fYear
    2006
  • fDate
    Oct. 29 2006-Nov. 2 2006
  • Firstpage
    28
  • Lastpage
    29
  • Abstract
    In this paper, we present the design, fabrication, and demonstration of optical through-wafer interconnects (TWIs). The interconnects were built using standard CMOS and MEMS fabrication processes
  • Keywords
    optical design techniques; optical fabrication; optical interconnections; 3D hyper-integration; optical through-wafer interconnect fabrication; optical through-wafer interconnects; standard CMOS process; standard MEMS fabrication process; Dielectric substrates; Etching; Integrated circuit interconnections; Integrated optics; Mirrors; Optical device fabrication; Optical interconnections; Optical polymers; Optical refraction; Optical waveguides;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society, 2006. LEOS 2006. 19th Annual Meeting of the IEEE
  • Conference_Location
    Montreal, Que.
  • Print_ISBN
    0-7803-9556-5
  • Type

    conf

  • DOI
    10.1109/LEOS.2006.278802
  • Filename
    4054039
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3124048