DocumentCode
3125710
Title
PSpice Modeling of Thermal Performance in Laser Diodes Packaging
Author
Zhou, Sheng ; Zhang, Xiupu
Author_Institution
Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que.
fYear
2006
fDate
Oct. 2006
Firstpage
172
Lastpage
173
Abstract
A PSpice model for laser diodes packaging was established to simulate its thermal behavior and cooling performance. Some heuristic analysis has been made by this model with concept clarity and simplicity
Keywords
SPICE; cooling; semiconductor device models; semiconductor device packaging; semiconductor lasers; thermal management (packaging); PSpice modeling; cooling performance; heuristic analysis; laser diodes packaging; thermal performance; Capacitors; Circuit simulation; Cooling; Diode lasers; Packaging; Superluminescent diodes; Temperature control; Thermal conductivity; Thermal resistance; Thermistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2006. LEOS 2006. 19th Annual Meeting of the IEEE
Conference_Location
Montreal, Que.
Print_ISBN
0-7803-9555-7
Electronic_ISBN
0-7803-9555-7
Type
conf
DOI
10.1109/LEOS.2006.278947
Filename
4054111
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