Thermal distribution during destructive pulses in ESD protection devices using a single-shot, two-dimensional interferometric method

Author

Pogany, D. ; Bychikhin, S. ; Kuzmik, J. ; Dubec, V. ; Jensen, N. ; Denison, M. ; Groos, G. ; Stecher, M. ; Gornik, E.

Author_Institution

Inst. for Solid State Electron., Vienna Univ. of Technol., Austria

fYear

2002

fDate

8-11 Dec. 2002

Firstpage

345

Lastpage

348

Abstract

Thermal distribution during single destructive electrostatic discharge (ESD) events is investigated in smart power ESD protection devices using a novel two-dimensional holographic interferometry technique. The hot spot dynamics and position of destructive current filaments is correlated with the thermal distribution under the non-destructive conditions and with the failure analysis results.

Keywords

electrostatic discharge; failure analysis; holographic interferometry; power bipolar transistors; power semiconductor diodes; protection; semiconductor device reliability; temperature distribution; thyristors; 2D imaging technique; Michelson-like interferometer; SCR ESD PDs; avalanche regime diode structure; destructive current filaments; destructive pulses; diode ESD PDs; failure analysis; hot spot dynamics; nondestructive conditions; npn ESD PDs; second breakdown; silicon controlled rectifier; single destructive electrostatic discharge events; single-shot two-dimensional interferometric method; smart power ESD protection devices; thermal distribution; two-dimensional holographic interferometry; Diodes; Electrostatic discharge; Electrostatic interference; Holography; Interferometry; Laser beams; Optical pulses; Probes; Protection; Thyristors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting, 2002. IEDM '02. International

Conference_Location

San Francisco, CA, USA

Print_ISBN

0-7803-7462-2

Type

conf

DOI

10.1109/IEDM.2002.1175849

Filename

1175849