• DocumentCode
    3129377
  • Title

    Development of CRC block onn FPGA for Zigbee standard

  • Author

    Ahmad, Radidah ; Sidek, Othman ; Mohd, Shukri Korakkottil Kunhi

  • Author_Institution
    Collaborative Microelectron. Design Excellence Centre (CEDEC), Univ. Sains Malaysia, Nibong Tebal, Malaysia
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    282
  • Lastpage
    285
  • Abstract
    CRC (cyclic redundanncy check) block was developed on FPGA (field programmable gate array) in order to meet the needs for simple, low-power and low-cost wireless communication such as Zigbee. Zigbee operates primarily in the 2.4 GHz band, which makes the technology easily applicable and worldwide available. This paper gives a short overview of CRC block in the digital transmitter based on Zigbee standard. CRC is the most preferred method of encoding because it provides very efficient protection against commonly occurring burst errors, and is easily implemented. The purpose of the research is to diversify the design methods by using the Verilog code entry through Xilinx ISE 8.2i. The Verilog code is used to characterize the CRC block behavior which is then simulated, synthesized and successfully implemented on Spartan3E XC3S500E FPGA. Here, the simulation and measurement results are also presented to verify the functionality of the CRC block. The data rate of CRC block is 250 kbps.
  • Keywords
    cyclic redundancy check codes; field programmable gate arrays; hardware description languages; logic design; personal area networks; radio transmitters; CRC block; FPGA; Spartan3E XC3S500E; Verilog code; Xilinx ISE 8.2i; Zigbee standard; cyclic redundanncy check block; digital transmitter; encoding; field programmable gate array; frequency 2.4 GHz; Cyclic redundancy check; Design methodology; Encoding; Field programmable gate arrays; Hardware design languages; Protection; Standards development; Transmitters; Wireless communication; ZigBee;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382117
  • Filename
    5382117