DocumentCode
3131581
Title
Session 19: Design, modeling & testing III
fYear
2009
fDate
21-23 Oct. 2009
Firstpage
509
Lastpage
509
Abstract
Start of the above-titled section of the conference proceedings record.
Keywords
Chip scale packaging; Contacts; Finite element methods; Mechanical engineering; Metallization; Probes; Semiconductor device modeling; Silicon; Substrates; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location
Taipei
Print_ISBN
978-1-4244-4341-3
Type
conf
DOI
10.1109/IMPACT.2009.5382230
Filename
5382230
Link To Document