Advanced process control: basic functionality requirements for lithography

Author

Gould, Christopher

Author_Institution

Infineon Technol. Richmond, Sandston, VA, USA

fYear

2001

fDate

2001

Firstpage

49

Lastpage

53

Abstract

Lithography in a high volume, state of the art manufacturing facility must have suitable systems in place to maintain control of critical device parameters such as pattern overlay (OL), and critical dimension (CD) on all parts manufactured. Methods of control such as litho cell qualification, wafer send ahead, extended tool preventive maintenance, and SPC alone are not only no longer sufficient to achieve the zero tolerance process budgets used at present, but are also detrimental to the cost effectiveness of current manufacturing. In order to achieve both the zero tolerance budgets and cost effective manufacturing, methods of advanced process control (APC) must be applied

Keywords

integrated circuit manufacture; integrated circuit technology; lithography; position control; process control; size control; SPC; advanced process control; critical device parameter control; critical dimension; extended tool preventive maintenance; functionality requirements; lithography; manufactured parts; pattern overlay; process control; volume manufacturing facility; wafer send ahead; Automatic control; Control systems; Damping; Feedback; Lithography; Predictive models; Process control; Production facilities; Semiconductor device manufacture; Semiconductor device modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference, 2001 IEEE/SEMI

Conference_Location

Munich

ISSN

1078-8743

Print_ISBN

0-7803-6555-0

Type

conf

DOI

10.1109/ASMC.2001.925614

Filename

925614