• DocumentCode
    3131861
  • Title

    Welcome message from Simon Chen, conference co-chair

  • Author

    Chen, Simon

  • Author_Institution
    Taiwan Printed Circuit Association, Taiwan
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    On behalf of Taiwan Printed Circuit Association (TPCA), I warmly welcome your participation in IMPACT Conference 2009 and International 3D IC Conference. After one year preparation, the organizers aim to provide all attendees a various conference to meet the conference theme-“IMPACT Your Future: Integration, Efficiency, & the Eco-Friendly”.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382246
  • Filename
    5382246
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3131861