DocumentCode
3132048
Title
Bead probes in practice
Author
Parker, Kenneth P.
Author_Institution
Agilent Technol., Loveland, CO
fYear
2005
fDate
8-8 Nov. 2005
Lastpage
636
Abstract
Bead probes, a technology for in-circuit test probing of high-speed and/or high-density printed circuit boards was introduced at the 2004 International Test Conference as stated in K. P. Parker (2004). Since then much experimentation has been done with bead probe technology, and a large, high-density board has been designed and produced that makes use of them. This paper discusses the learning from these efforts
Keywords
printed circuit testing; probes; test equipment; bead probes; high density printed circuit boards; in-circuit test; Circuit testing; Copper; Fixtures; Gravity; Manufacturing; Pins; Printed circuits; Probes; Shape; Surface tension;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2005. Proceedings. ITC 2005. IEEE International
Conference_Location
Austin, TX
Print_ISBN
0-7803-9038-5
Type
conf
DOI
10.1109/TEST.2005.1584024
Filename
1584024
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