• DocumentCode
    3132135
  • Title

    Achieving good correlation results between bitmap and TENCOR data

  • Author

    Merino, Miguel ; Mateos, Carlos ; Terryll, Kathy

  • Author_Institution
    Agere Syst., Madrid, Spain
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    131
  • Lastpage
    134
  • Abstract
    Software to correlate memory bitmap to defect data has become a standard tool for yield analysis, because it provides extraordinarily useful information about yield limiters. Currently, this analysis software is limited to process KLA data. Although TENCOR inspection machines are widely used as production inspection tools, defect information provided by the TENCORs has not been used to correlate to bitmap data, because the TENCOR alignment capabilities are not good enough to achieve good correlation results. We present a method to correlate bitmap information to TENCOR data. This method is based on a set of algorithms used to process the TENCOR inspection files to minimize the native misalignment problems present in the TENCOR inspection machines. By means of these algorithms, TENCOR data can be correlated to the bitmap data as well as that of KLAs, opening new possibilities for the yield analyst
  • Keywords
    correlation methods; electronic engineering computing; inspection; integrated circuit reliability; integrated circuit testing; integrated circuit yield; manufacturing data processing; KLA data processing; TENCOR alignment capability; TENCOR data; TENCOR defect information; TENCOR inspection files; TENCOR inspection machines; analysis software; bitmap data; bitmap information correlation; bitmap/TENCOR data correlation; correlation software; defect data; production inspection tools; yield analysis; yield limiters; Computer industry; Correlators; Information analysis; Inspection; Packaging; Production; Semiconductor device manufacture; Software standards; Software tools; Spatial databases;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference, 2001 IEEE/SEMI
  • Conference_Location
    Munich
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-6555-0
  • Type

    conf

  • DOI
    10.1109/ASMC.2001.925633
  • Filename
    925633