DocumentCode
3132135
Title
Achieving good correlation results between bitmap and TENCOR data
Author
Merino, Miguel ; Mateos, Carlos ; Terryll, Kathy
Author_Institution
Agere Syst., Madrid, Spain
fYear
2001
fDate
2001
Firstpage
131
Lastpage
134
Abstract
Software to correlate memory bitmap to defect data has become a standard tool for yield analysis, because it provides extraordinarily useful information about yield limiters. Currently, this analysis software is limited to process KLA data. Although TENCOR inspection machines are widely used as production inspection tools, defect information provided by the TENCORs has not been used to correlate to bitmap data, because the TENCOR alignment capabilities are not good enough to achieve good correlation results. We present a method to correlate bitmap information to TENCOR data. This method is based on a set of algorithms used to process the TENCOR inspection files to minimize the native misalignment problems present in the TENCOR inspection machines. By means of these algorithms, TENCOR data can be correlated to the bitmap data as well as that of KLAs, opening new possibilities for the yield analyst
Keywords
correlation methods; electronic engineering computing; inspection; integrated circuit reliability; integrated circuit testing; integrated circuit yield; manufacturing data processing; KLA data processing; TENCOR alignment capability; TENCOR data; TENCOR defect information; TENCOR inspection files; TENCOR inspection machines; analysis software; bitmap data; bitmap information correlation; bitmap/TENCOR data correlation; correlation software; defect data; production inspection tools; yield analysis; yield limiters; Computer industry; Correlators; Information analysis; Inspection; Packaging; Production; Semiconductor device manufacture; Software standards; Software tools; Spatial databases;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2001 IEEE/SEMI
Conference_Location
Munich
ISSN
1078-8743
Print_ISBN
0-7803-6555-0
Type
conf
DOI
10.1109/ASMC.2001.925633
Filename
925633
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