DocumentCode
3132190
Title
Session 23: PTH & metal finishing
fYear
2009
fDate
21-23 Oct. 2009
Firstpage
624
Lastpage
624
Abstract
Start of the above-titled section of the conference proceedings record.
Keywords
Bonding; Electronic equipment testing; Environmentally friendly manufacturing techniques; Finishing; Gold; Lead; Nanoparticles; Palladium; Stability; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location
Taipei
Print_ISBN
978-1-4244-4341-3
Type
conf
DOI
10.1109/IMPACT.2009.5382262
Filename
5382262
Link To Document