UV-LIGA: a promising and low-cost variant for microsystem technology

Author

Qu, Wenmin ; Wenzel, Christian ; Jahn, Andreas ; Zeidler, Dieter

Author_Institution

Inst. for Semicond. & Microsyst. Technol., Tech. Univ. Dresden, Germany

fYear

1999

fDate

1999

Firstpage

380

Lastpage

383

Abstract

A low-cost surface microstructuring technique is described and examples provided of its recent application. The new technology, UV-LIGA combines depth UV lithographic patterning of very thick photoresists and electrodepositing of structural materials into the patterned resist moulds. Both UV lithography and electrodeposition do not need any expensive or special equipment. Movable three dimensional microstructures with a high aspect ratio can be obtained by combining the UV-LIGA process with a sacrificial layer technique. As an example of the advanced application in microsystems, fabrication of 3D accelerometers has been presented, using titanium as a sacrificial layer and nickel as the structural material

Keywords

LIGA; accelerometers; electrodeposition; micromachining; microsensors; nickel; photoresists; titanium; ultraviolet lithography; 3D accelerometers; Ni-Ti; UV-LIGA; depth UV lithographic patterning; electrodeposition; high aspect ratio; low-cost; low-cost surface microstructuring technique; microsystem technology; nickel structural material; patterned resist moulds; sacrificial layer technique; thick photoresists; three dimensional microstructures; titanium sacrificial layer; Accelerometers; Coatings; Fabrication; Lithography; Microelectronics; Microstructure; Optical surface waves; Resists; Semiconductor materials; Ultraviolet sources;

fLanguage

English

Publisher

ieee

Conference_Titel

Optoelectronic and Microelectronic Materials Devices, 1998. Proceedings. 1998 Conference on

Conference_Location

Perth, WA

Print_ISBN

0-7803-4513-4

Type

conf

DOI

10.1109/COMMAD.1998.791668

Filename

791668