DocumentCode
3139295
Title
Transaction Level Modeling for Early Verification on Embedded System Design
Author
Abdurohman, Maman ; Kuspriyanto ; Sutikno, Sarwono ; Sasongko, Arif
Author_Institution
Informatic Dept., IT Telkom, Bandung, Indonesia
fYear
2009
fDate
1-3 June 2009
Firstpage
277
Lastpage
282
Abstract
Time-to-market pressure and productivity gap are two factors that encourage the electronic design automation (EDA) industry and researcher of embedded system to enhance embedded system design method. Current embedded system design approach, register transfer level, is not sufficient to fulfill the embedded system design necessity. It needs a new design method above RTL, higher abstraction layer. Electronic system level is general term that used to name system above RTL. ESL definition so far is a system above RTL including hardware and software. In this paper we designed a transaction level modeling for early verification on embedded system design. This modeling is used to know functionality fulfillment at early stage. We specify four kind model for early verification purpose.
Keywords
electronic design automation; embedded systems; hardware description languages; logic partitioning; logic testing; EDA industry; ESL definition; HW/SW partitioning; early verification; electronic design automation; electronic system level; embedded system design verification; hardware description language; register transfer level; time-to-market pressure; transaction level modeling; Costs; Design methodology; Electronic design automation and methodology; Electronics industry; Embedded software; Embedded system; Hardware design languages; Integrated circuit modeling; Software design; Time to market; Early Verification; Electronic System Level (ESL); Register Transfer level (RTL); SystemC; Transaction Level Modeling(TLM);
fLanguage
English
Publisher
ieee
Conference_Titel
Computer and Information Science, 2009. ICIS 2009. Eighth IEEE/ACIS International Conference on
Conference_Location
Shanghai
Print_ISBN
978-0-7695-3641-5
Type
conf
DOI
10.1109/ICIS.2009.41
Filename
5222871
Link To Document