• DocumentCode
    3139295
  • Title

    Transaction Level Modeling for Early Verification on Embedded System Design

  • Author

    Abdurohman, Maman ; Kuspriyanto ; Sutikno, Sarwono ; Sasongko, Arif

  • Author_Institution
    Informatic Dept., IT Telkom, Bandung, Indonesia
  • fYear
    2009
  • fDate
    1-3 June 2009
  • Firstpage
    277
  • Lastpage
    282
  • Abstract
    Time-to-market pressure and productivity gap are two factors that encourage the electronic design automation (EDA) industry and researcher of embedded system to enhance embedded system design method. Current embedded system design approach, register transfer level, is not sufficient to fulfill the embedded system design necessity. It needs a new design method above RTL, higher abstraction layer. Electronic system level is general term that used to name system above RTL. ESL definition so far is a system above RTL including hardware and software. In this paper we designed a transaction level modeling for early verification on embedded system design. This modeling is used to know functionality fulfillment at early stage. We specify four kind model for early verification purpose.
  • Keywords
    electronic design automation; embedded systems; hardware description languages; logic partitioning; logic testing; EDA industry; ESL definition; HW/SW partitioning; early verification; electronic design automation; electronic system level; embedded system design verification; hardware description language; register transfer level; time-to-market pressure; transaction level modeling; Costs; Design methodology; Electronic design automation and methodology; Electronics industry; Embedded software; Embedded system; Hardware design languages; Integrated circuit modeling; Software design; Time to market; Early Verification; Electronic System Level (ESL); Register Transfer level (RTL); SystemC; Transaction Level Modeling(TLM);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer and Information Science, 2009. ICIS 2009. Eighth IEEE/ACIS International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-0-7695-3641-5
  • Type

    conf

  • DOI
    10.1109/ICIS.2009.41
  • Filename
    5222871