• DocumentCode
    3140269
  • Title

    A 0.18 /spl mu/m fully depleted CMOS on 30 nm thick SOI for sub-1.0 V operation

  • Author

    Imai, K. ; Onishi, H. ; Yamaguchi, K. ; Inoue, K. ; Matsubara, Y. ; Ono, A. ; Horiuchi, T.

  • Author_Institution
    ULSI Device Dev. Lab., NEC Corp., Sagamihara, Japan
  • fYear
    1998
  • fDate
    9-11 June 1998
  • Firstpage
    116
  • Lastpage
    117
  • Abstract
    A process has been developed for fabricating 0.18 /spl mu/m CMOS devices that have excellent performance at low voltage. It uses fully depleted SOI technology. To suppress degradation of subthreshold slope due to the short channel effect, the SOI film is drastically thinned to 30 nm. An ultra-thin cobalt silicide layer efficiently reduces the high parasitic source/drain resistance that occurs with thin SOI film. The fabricated devices, which keep a subthreshold slope of less than 70 mV/decade, have a switching speed more than 1.5 times faster than that of bulk CMOS devices, when the supply voltage is 1.0 V or less.
  • Keywords
    MOSFET; low-power electronics; semiconductor device reliability; silicon-on-insulator; 0.18 micron; 1.0 V; 30 nm; Si; fully depleted CMOS; fully depleted SOI technology; low voltage performance; parasitic source/drain resistance; short channel effect; subthreshold slope degradation; switching speed; Cobalt; Fabrication; Immune system; Inverters; MOS devices; MOSFETs; Propagation delay; Thin film devices; Titanium; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1998. Digest of Technical Papers. 1998 Symposium on
  • Conference_Location
    Honolulu, HI, USA
  • Print_ISBN
    0-7803-4770-6
  • Type

    conf

  • DOI
    10.1109/VLSIT.1998.689223
  • Filename
    689223