Modeling of Tape Automated Bonding (TAB) for High Performance Integrated Circuits

Author

Hassaine, N. ; Villeneuve, L. ; Shen, Y. ; Concilio, F.

Author_Institution

Microwave Commun. Div., Harris Corp., Dollard-des-Ormeaux, Que.

fYear

2006

fDate

38838

Firstpage

2464

Lastpage

2467

Abstract

This study investigates the computing of the inductance of the tape automated bonding (TAB), The [L] matrix calculation is performed with the potential vector given in an integral form, taking into account the current density distribution on the conductors. The partial element equivalent circuit method (PEEC) is used for this calculation. Analytical formula easy to use in CAD is derived from the numerical results using a least square method. The formula has been shown a good agreement, with a precision in the order of 5%, with simulation results and with experimental results obtained on test boards in the frequency range 1-30 GHz

Keywords

circuit CAD; equivalent circuits; integrated circuits; matrix algebra; tape automated bonding; CAD; integrated circuit fabrication; matrix calculation; partial element equivalent circuit method; tape automated bonding; Bonding; Circuit simulation; Conductors; Current density; Distributed computing; Equivalent circuits; Inductance; Integrated circuit modeling; Least squares methods; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical and Computer Engineering, 2006. CCECE '06. Canadian Conference on

Conference_Location

Ottawa, Ont.

Print_ISBN

1-4244-0038-4

Electronic_ISBN

1-4244-0038-4

Type

conf

DOI

10.1109/CCECE.2006.277504

Filename

4054895