• DocumentCode
    3143307
  • Title

    Call for papers

  • fYear
    2009
  • fDate
    18-22 Oct. 2009
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    The IEEE International Integrated Reliability Workshop (IRW) originated from the Wafer Level Reliability Workshop in 1982. The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Through tutorials, paper presentations, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding, developing, and sharing reliability technology and test methodology for present and future semiconductor applications as well as ample opportunity for discussions and interactions with colleagues.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2009. IRW '09. IEEE International
  • Conference_Location
    South Lake Tahoe, CA, USA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4244-3921-8
  • Electronic_ISBN
    1930-8841
  • Type

    conf

  • DOI
    10.1109/IRWS.2009.5382998
  • Filename
    5382998