DocumentCode
3144016
Title
A fast, simple wafer-level Hall-mobility measurement technique
Author
Yu, L.C. ; Cheung, K.P. ; Tilak, V. ; Dunne, G. ; Matocha, K. ; Campbell, J.P. ; Suehle, J.S. ; Sheng, K.
Author_Institution
Semicond. Electron. Div., NIST, Gaithersburg, MD, USA
fYear
2009
fDate
18-22 Oct. 2009
Firstpage
73
Lastpage
76
Abstract
Mobility is a good indicator of device reliability. High channel mobility is one of the biggest challenges especially in novel devices such as high-k based MOSFET, III-V devices and SiC power MOSFET etc. Accurate measurement of channel mobility is required for studying the limiting mechanism of mobility. Hall mobility is more favorable than effective mobility or field effect mobility because it takes into account only the mobile charges, which is essential for measuring novel devices that have a very high trap density. However, regular Hall measurement involves a bulky system and tedious sample preparation, which inhibit frequent use. In this paper, we demonstrate a fast and easy to implement wafer-level Hall-mobility measurement technique that allows for large survey of many devices under various conditions.
Keywords
Hall mobility; MOSFET; wafer bonding; Hall mobility; SiC; device reliability; field effect mobility; high channel mobility; power MOSFET; trap density; wafer-level hall-mobility measurement technique; Current measurement; Density measurement; Hall effect; High K dielectric materials; High-K gate dielectrics; III-V semiconductor materials; MOSFET circuits; Measurement techniques; Power MOSFET; Silicon carbide;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2009. IRW '09. IEEE International
Conference_Location
S. Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4244-3921-8
Electronic_ISBN
1930-8841
Type
conf
DOI
10.1109/IRWS.2009.5383030
Filename
5383030
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