Application of Holography to evaluation of printed circuit board connector due to thermal stress

Author

Kubota, Hiromichi ; Taniguchi, Masanari ; Suzuki, Shosuke ; Takagi, Tasuku

Author_Institution

Tohoku Bunka Gakuen Univ., Sendai

fYear

2008

fDate

20-22 Aug. 2008

Firstpage

338

Lastpage

343

Abstract

Printed circuit board connectors (PCB connectors) were tested by using the HPMS (Holographic Pattern Measuring System) , that has been developed by the authors to estimate the surface deformation due to thermal stress. The system was well performed to investigate the PCB connector contact failure process as a model investigation. The analysis was only on a stage of qualitative, however, some important suggestions were obtained for the future usage and selection of not only PCB connector itself but also selection of socket pin for power supply in the selected connector.

Keywords

electric connectors; holography; interferometry; printed circuits; thermal stresses; PCB connector; Thermal Stress; contact failure process; holographic pattern measuring system; holography; printed circuit board connector; socket pin; surface deformation; Circuit testing; Connectors; Contacts; Holography; Power system modeling; Printed circuits; Sockets; Stress measurement; System testing; Thermal stresses; Holography; Interferometry measurement; Printed circuit board connector; Thermal deformation;

fLanguage

English

Publisher

ieee

Conference_Titel

SICE Annual Conference, 2008

Conference_Location

Tokyo

Print_ISBN

978-4-907764-30-2

Electronic_ISBN

978-4-907764-29-6

Type

conf

DOI

10.1109/SICE.2008.4654676

Filename

4654676