• DocumentCode
    3152607
  • Title

    The gap: Test challenges in Asia manufacturing field

  • Author

    Gu, Xinli

  • Author_Institution
    Huawei
  • fYear
    2011
  • fDate
    20-22 Sept. 2011
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Today, more and more electronic manufacturing is being done in Asia. Test, as one of the important functions of manufacturing, is critical to guarantee the product quality and as a monitor of the manufacturing process. Through presenting the gap between the test challenges the Asia companies are facing and the tools they have today, we hope give the ITC community an opportunity to better understand the needs of innovation for test technologies and tools. This panel invites speakers from companies in Asia to present their test challenges and current solutions. It covers both design for test challenges and the complexities of the production test challenges. The focus is on the gap between what they need with today´s challenges and the current capabilities.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference (ITC), 2011 IEEE International
  • Conference_Location
    Anaheim, CA, USA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4577-0153-5
  • Type

    conf

  • DOI
    10.1109/TEST.2011.6139195
  • Filename
    6139195