DocumentCode
3152607
Title
The gap: Test challenges in Asia manufacturing field
Author
Gu, Xinli
Author_Institution
Huawei
fYear
2011
fDate
20-22 Sept. 2011
Firstpage
1
Lastpage
1
Abstract
Today, more and more electronic manufacturing is being done in Asia. Test, as one of the important functions of manufacturing, is critical to guarantee the product quality and as a monitor of the manufacturing process. Through presenting the gap between the test challenges the Asia companies are facing and the tools they have today, we hope give the ITC community an opportunity to better understand the needs of innovation for test technologies and tools. This panel invites speakers from companies in Asia to present their test challenges and current solutions. It covers both design for test challenges and the complexities of the production test challenges. The focus is on the gap between what they need with today´s challenges and the current capabilities.
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference (ITC), 2011 IEEE International
Conference_Location
Anaheim, CA, USA
ISSN
1089-3539
Print_ISBN
978-1-4577-0153-5
Type
conf
DOI
10.1109/TEST.2011.6139195
Filename
6139195
Link To Document