• DocumentCode
    3153490
  • Title

    Recent topics of the medium-voltage switchgear in Japan

  • Author

    Morita, A.

  • Author_Institution
    Power & Ind. Syst. R & D Lab., Hitachi Ltd., Ibaraki, Japan
  • Volume
    2
  • fYear
    2002
  • fDate
    6-10 Oct. 2002
  • Firstpage
    1450
  • Abstract
    This paper introduces three items of newly developed 22 kV switchgear from Japan. These are: (1) switchgear with multifunctional vacuum interrupters, which enable significant downsizing through the use of a functional integration concept. The multi-functional vacuum interrupter integrates four functions (making, breaking, disconnecting, and grounding of the circuit) in a unit vacuum vessel. (2) A new type of air-insulated switchgear, which utilizes moderately compressed air and insulation barriers between the poles. Gas pressure dependence and barrier effect on the insulation is investigated experimentally. (3) Switchgear that uses solid insulation. All of the main-circuits, including vacuum interrupters, are molded by recyclable material. A composite insulation technique, using air and solids, is applied to movable parts, whose insulation ability is improved two or threefold over air alone. Finally, some basic research on vacuum insulation is introduced.
  • Keywords
    air insulation; composite materials; gas insulated switchgear; vacuum interrupters; 22 kV; Japan; air-insulated switchgear; barrier effect; composite insulation; gas pressure dependence; insulation barriers; medium-voltage switchgear; moderately compressed air; multi-functional vacuum interrupter; multifunctional vacuum interrupters; recyclable material; unit vacuum vessel; vacuum interrupters; Costs; Gas insulation; Interrupters; Medium voltage; Solids; Sulfur hexafluoride; Switches; Switchgear; Switching circuits; Vacuum technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transmission and Distribution Conference and Exhibition 2002: Asia Pacific. IEEE/PES
  • Print_ISBN
    0-7803-7525-4
  • Type

    conf

  • DOI
    10.1109/TDC.2002.1177694
  • Filename
    1177694