DocumentCode
3153519
Title
Microelectronics for space applications - challenges and opportunities
Author
Kayali, S.
Author_Institution
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA
fYear
2007
fDate
15-18 Oct. 2007
Abstract
The selection and application of microelectronic components in high reliability space systems requires knowledge of the component design, fabrication process, and applicable tests. In addition, reliability analysis and detailed knowledge of the application environment is necessary in order to determine the suitability of the selected component for the application. These issues are of particular importance for the application of semiconductor devices in high reliability systems due to the need for the utilization of large numbers of these devices at the upper limit of their performance and stress capabilities. In order to collect the reliability and characterization data required for space qualification, an in-depth understanding of the material characteristics, fabrication processes, and relevant failure mechanisms of the technology is necessary. This presentation provides a description of the technical and programmatic challenges affecting the insertion of advanced microelectronics in NASA/JPL flight applications and the methodology necessary to ensure the desired reliability.
Keywords
aerospace engineering; integrated circuit reliability; integrated circuits; radiation hardening (electronics); NASA-JPL flight applications; failure mechanisms; high reliability space systems; microelectronic components; reliability analysis; semiconductor devices; Fabrication; Materials reliability; Microelectronics; Process design; Qualifications; Semiconductor device reliability; Semiconductor devices; Space technology; Stress; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2007. IRW 2007. IEEE International
Conference_Location
S. Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4244-1771-9
Electronic_ISBN
1930-8841
Type
conf
DOI
10.1109/IRWS.2007.4469209
Filename
4469209
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