Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates

Author

Ghiu, Camil-Daniel ; Dalmia, Sidharth ; Vickers, Jack ; Carastro, Larry ; Czakon, Winston ; Sundaram, Venky ; White, George

Author_Institution

Jacket Micro Devices, Atlanta, GA

fYear

2006

fDate

10-13 Sept. 2006

Firstpage

545

Lastpage

547

Abstract

This paper presents the performance of 3D packaging solutions based on novel multilayered organic substrates. Electrical performance of embedded RF passives over 950 MHz to 3 GHz frequency range and stability from -40degC to 85degC has been demonstrated in an organic laminate substrate. Stand-alone, high Q inductors built on a multilayered liquid crystalline polymer (LCP)-based substrate can withstand a 2A direct current with the temperatures well within the safe range. The power handling capability of surface mounted IPDs is also assessed in this study. Reliability test data demonstrated the multilayer substrate compatibility with 1times and 3times lead free solder reflow. A promising high temperature LCP material enabled a significant improvement in the stability of electrical performance after 3times reflow at 260 degC

Keywords

liquid crystal polymers; reflow soldering; reliability; substrates; surface mount technology; -40 to 85 C; 2 A; 260 C; 950 to 3000 MHz; advanced 3D packaging; diplexer; embedded RF passives; lead free solder reflow; liquid crystalline polymer; multilayered organic substrates; organic laminate substrate; power handling capability; reliability test data; surface mounted IPD; Crystallization; Inductors; Laminates; Liquid crystal polymers; Nonhomogeneous media; Packaging; Radio frequency; Stability; Temperature distribution; Testing; Diplexer; IPD; direct current; organics; packaging; substrate; thermal;

fLanguage

English

Publisher

ieee

Conference_Titel

European Microwave Integrated Circuits Conference, 2006. The 1st

Conference_Location

Manchester

Print_ISBN

2-9600551-8-7

Type

conf

DOI

10.1109/EMICC.2006.282704

Filename

4057698