• DocumentCode
    3159688
  • Title

    Feasibility tests of SiC thin films by sputtering

  • Author

    Axelevitch, A. ; Vainshtok, E. ; Sigalov, B. ; Gorenstein, B. ; Golan, G.

  • Author_Institution
    Holon Acad. Inst. of Technol., Israel
  • fYear
    2002
  • fDate
    1 Dec. 2002
  • Firstpage
    55
  • Abstract
    Summary form only given. Silicon carbide (SiC) is one of the most important materials in recent years. SiC single crystalline substrates are used for high-temperature and fast-acting electron devices. The hydrogenated amorphous silicon-carbide alloy thin films have been of technical interest as an optoelectronic material. These films have important applications also as p-type layers in amorphous silicon photovoltaic devices. Common methods applied for silicon carbide films deposition are plasma enhanced CVD under plasma decomposition of organic compounds such as CH4, C2H2, C3H8. In this paper, SixCy thin films were deposited on silicon and glass substrates using magnetron DC sputtering, a ceramic SiC target and argon plasma. Sputtering was provided as a continuous process and as a consequent sputtering of two targets: ceramic SiC and single crystalline Si. Optical, and dielectric properties of the obtained films were investigated. The obtained films were transparent and behaved as dielectric in the Al-SixCy-Al and Al-SixCy-Si structures.
  • Keywords
    MIS structures; semiconductor growth; semiconductor thin films; silicon compounds; sputtered coatings; transparency; wide band gap semiconductors; Al-SixCy-Al structure; Al-SixCy-Si structure; Al-SiC-Al; Al-SiC-Si; SiC; SiC thin film; dielectric properties; glass substrate; magnetron DC sputtering; optical properties; silicon substrate; transparency; Crystalline materials; Crystallization; Optical films; Plasma applications; Plasma devices; Semiconductor films; Semiconductor thin films; Silicon carbide; Sputtering; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Electronics Engineers in Israel, 2002. The 22nd Convention of
  • Print_ISBN
    0-7803-7693-5
  • Type

    conf

  • DOI
    10.1109/EEEI.2002.1178318
  • Filename
    1178318