• DocumentCode
    3159992
  • Title

    Evaluation of Cooling Solutions for Outdoor Electronics

  • Author

    Wankhede, Mahendra ; Khaire, Vivek ; Goswami, Avijit ; Mahajan, S.D.

  • Author_Institution
    Appl. Thermal Technol. India, Pune
  • fYear
    2007
  • fDate
    10-12 Dec. 2007
  • Firstpage
    858
  • Lastpage
    863
  • Abstract
    The thermal management of an outdoor electronic enclosure can be quite challenging due to the additional thermal load from the sun and the requirement of having an air-sealed enclosure. It is essential to consider the effect of solar heating loads in the design process; otherwise, it can shorten the life expectancy of the electronic product or lead to catastrophic failure. The main objective of this work is to analyze and compare the effectiveness of different cooling techniques used for outdoor electronics. Various cooling techniques were compared like special coats and paints on the outer surface, radiation shield, double-walled enclosure, fans for internal air circulation and air-to-air heat exchangers. A highly simplified, typical outdoor system was selected for this study measuring approximately 300times300times400 mm (WxLxH). Solar radiation was incident on 3 sides of the enclosure. There were 8 equally spaced PCBs inside the enclosure dissipating 12.5 W each uniformly (100 watts total). A computational fluid dynamics (CFD) model of the system was built and analyzed. This was followed by building a mock-up of the system and conducting experiments to validate the CFD model. It was found that some of the simplest cooling techniques like white oil paint on the outer surface can significantly reduce the impact of solar loads. Adding internal circulation fans can also be very effective. Using air-to-air heat exchangers was found to be the most effective solution although it is more complex and costly.
  • Keywords
    computational fluid dynamics; cooling; fans; heat exchangers; paints; printed circuits; sunlight; thermal management (packaging); CFD model; PCB; air-to-air heat exchangers; computational fluid dynamics model; cooling techniques; internal circulation fans; outdoor electronics; power 12.5 W; solar heating loads; solar radiation; thermal load; thermal management; white oil paint; Computational fluid dynamics; Electronics cooling; Fans; Paints; Process design; Solar heating; Sun; Thermal loading; Thermal management; Thermal management of electronics; Thermal management; electronics cooling; outdoor cooling; solar loading;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-1323-2
  • Electronic_ISBN
    978-1-4244-1323-2
  • Type

    conf

  • DOI
    10.1109/EPTC.2007.4469682
  • Filename
    4469682