• DocumentCode
    3161385
  • Title

    Heat Transfer Enhancement Using Synthetic Jets for Cooling in Low Form Factor Electronics in Presence of Mean Flow

  • Author

    Mongia, Rajiv K. ; Macdonald, Mark A. ; Mccune, Joshua S. ; Pavlova, Anna ; Trautman, Mark A. ; Bhattacharya, A.

  • Author_Institution
    Intel Corp., Santa Clara
  • fYear
    2007
  • fDate
    10-12 Dec. 2007
  • Firstpage
    830
  • Lastpage
    835
  • Abstract
    This paper reports the results of our experimental studies on interaction of synthetic jets with a bulk flow over a heated surface in a low profile channel as well as its impact on overall heat transfer enhancement. Particle image velocimetry (PIV) studies were conducted to study the impact of jet frequency, mean flow velocity and synthetic jet orientation on the flow and heat transfer characteristics. The results showed an increase in jet velocity and hence heat transfer with an increase in frequency. Reduction in mean flow velocity facilitated entrainment of the synthetic jet and also led to its delayed dispersion. The thermal results were consistent with the flow patterns observed and heat transfer enhancements as high as 30% were observed. However, regions of attenuated heat transfer were also seen in cross-flow which needs careful consideration during thermal design.
  • Keywords
    cooling; electronics packaging; jets; bulk flow; heat transfer enhancement; low form factor electronics; mean flow; particle image velocimetry; synthetic jets; Delay; Educational institutions; Electronics cooling; Frequency; Geometry; Heat sinks; Heat transfer; Orifices; Physics; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-1323-2
  • Electronic_ISBN
    978-1-4244-1323-2
  • Type

    conf

  • DOI
    10.1109/EPTC.2007.4469758
  • Filename
    4469758