DocumentCode
3161385
Title
Heat Transfer Enhancement Using Synthetic Jets for Cooling in Low Form Factor Electronics in Presence of Mean Flow
Author
Mongia, Rajiv K. ; Macdonald, Mark A. ; Mccune, Joshua S. ; Pavlova, Anna ; Trautman, Mark A. ; Bhattacharya, A.
Author_Institution
Intel Corp., Santa Clara
fYear
2007
fDate
10-12 Dec. 2007
Firstpage
830
Lastpage
835
Abstract
This paper reports the results of our experimental studies on interaction of synthetic jets with a bulk flow over a heated surface in a low profile channel as well as its impact on overall heat transfer enhancement. Particle image velocimetry (PIV) studies were conducted to study the impact of jet frequency, mean flow velocity and synthetic jet orientation on the flow and heat transfer characteristics. The results showed an increase in jet velocity and hence heat transfer with an increase in frequency. Reduction in mean flow velocity facilitated entrainment of the synthetic jet and also led to its delayed dispersion. The thermal results were consistent with the flow patterns observed and heat transfer enhancements as high as 30% were observed. However, regions of attenuated heat transfer were also seen in cross-flow which needs careful consideration during thermal design.
Keywords
cooling; electronics packaging; jets; bulk flow; heat transfer enhancement; low form factor electronics; mean flow; particle image velocimetry; synthetic jets; Delay; Educational institutions; Electronics cooling; Frequency; Geometry; Heat sinks; Heat transfer; Orifices; Physics; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location
Singapore
Print_ISBN
978-1-4244-1323-2
Electronic_ISBN
978-1-4244-1323-2
Type
conf
DOI
10.1109/EPTC.2007.4469758
Filename
4469758
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