DocumentCode
3161451
Title
Properties of new solder paste system with ultra low residue for Die Attach and DCB
Author
Schmitt, Wolfgang ; Davies, Jason ; Ping, Sim Tiow
Author_Institution
W.C. Heraeus GmbH, Hanau
fYear
2007
fDate
10-12 Dec. 2007
Firstpage
161
Lastpage
166
Abstract
Since the beginning of the SMT process solder pastes have been developed and manufactured on the basis of resins/rosins. Due to problems caused by residues in the SMT and Semiconductor applications it was decided to develop an ultra low residue solder paste.
Keywords
beams (structures); cantilevers; microassembling; reflow soldering; resins; semiconductor technology; solders; surface mount technology; DCB; SMT process solder pastes; die attach; double cantilever beams; resins; rosins; semiconductor applications; ultra low residue solder paste; Microassembly; Powders; Resins; Rheology; Soldering; Stability; Surface-mount technology; System testing; Temperature; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location
Singapore
Print_ISBN
978-1-4244-1323-2
Electronic_ISBN
978-1-4244-1323-2
Type
conf
DOI
10.1109/EPTC.2007.4469761
Filename
4469761
Link To Document