DocumentCode
3161815
Title
Study on mobility of water and polymer chain in epoxy for microelectronic applications
Author
Luo, Shijian ; Leisen, Johannes ; Wong, C.P.
Author_Institution
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2001
fDate
2001
Firstpage
149
Lastpage
154
Abstract
This paper presents a study on mobility of water and polymer chain in epoxy materials. Solid state nuclear magnetic resonance (NMR) techniques (both 1H NMR and 2H NMR) were used to study the binding states of water within two epoxy formulations along with the possible plasticizing effects of moisture affecting the mobility of polymer chains. Absorbed water reduces the glass transition temperature of polymeric material. However, the presence of moisture has no significant effect on the polymer chain mobility at temperatures below the reduced glass transition temperature. Water in an epoxy in its rubbery state above the glass transition has a much higher mobility than in a polymer in its glassy state. The mobility of water absorbed by a polymer in its rubbery state is similar to that of pure water. The translational mobility of water within epoxies was studied by measuring the diffusion coefficient of water in epoxies through the water uptake. Higher rotational mobilities of water and polymer chains in the rubbery state lead to a significant increase of the water diffusion coefficient in the rubbery state polymer matrix as compared to a polymer in its glassy state
Keywords
diffusion; glass transition; moisture; nuclear magnetic resonance; polymers; sorption; water; 1H NMR; 2H NMR; binding state; epoxy resin; glass transition temperature; glassy state; microelectronic material; moisture diffusion; plasticizing effect; polymer chain mobility; rubbery state; solid-state nuclear magnetic resonance; water absorption; water mobility; Glass; Hybrid integrated circuits; Materials science and technology; Microelectronics; Moisture; Nuclear magnetic resonance; Packaging; Polymers; Temperature; Topology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location
Orlando, FL
ISSN
0569-5503
Print_ISBN
0-7803-7038-4
Type
conf
DOI
10.1109/ECTC.2001.927710
Filename
927710
Link To Document