Modeling and evaluating leadframe CSPs for RFICs in wireless applications

Author

Horng, T.S. ; Wu, S.-M. ; Huang, H.H. ; Chiu, C.T. ; Hung, C.P.

Author_Institution

Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan

fYear

2001

fDate

2001

Firstpage

348

Lastpage

352

Abstract

The electrical models of leadframe plastic CSPs (Chip Scale Packages) for RFICs have been established based on the S-parameter measurement. To evaluate their RF performance, an on-chip 50 ohm microstrip line was housed in a 32-pin BCC (Bump Chip Carrier) package. The insertion and return losses were calculated against frequency and compared to measurement. Excellent agreement has been observed up to 15 GHz. The package acts as a low-pass filter to cause a sharp cut off for the 50 ohm microstrip line operating above a certain frequency, which was predicted successfully from the established package models

Keywords

MMIC; S-parameters; chip scale packaging; integrated circuit modelling; losses; microstrip lines; plastic packaging; 50 ohm; RFICs; S-parameter measurement; bump chip carrier; electrical models; insertion losses; leadframe CSPs; low-pass filter; microstrip line; package models; plastic CSPs; return losses; wireless applications; Chip scale packaging; Electric variables measurement; Frequency measurement; Insertion loss; Microstrip; Plastic packaging; Radio frequency; Radiofrequency integrated circuits; Scattering parameters; Semiconductor device measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927747

Filename

927747