Advanced packaging technologies on 3D stacked LSI utilizing the micro interconnections and the layered microthin encapsulation

Author

Tomita, Yoshihiro ; Morifuji, Tadahiro ; Ando, Tatsuya ; Tago, Masamoto ; Kajiwara, Ryoichi ; Nemoto, Yoshihiko ; Fujii, Tomonori ; Kitayama, Yoshifumi ; Takahashi, Kenji

Author_Institution

Dept. of Electron. Syst. Integration Technol. Res., Tsukuba Res. Center, Ibaraki, Japan

fYear

2001

fDate

2001

Firstpage

353

Lastpage

360

Abstract

The advanced 3D stacking technologies are discussed in this paper. They are the microbumping in 20 μm pitch, the basic processes of the advanced bonding processes for the high precision and the reliable interconnections, the novel technologies to encapsulate the layered microthin gaps less than 10 μm, and the non-destructive inspection. These technologies are confirmed to realize the 3D stacked LSI structure, and it will be expanded to the advanced system packaging technologies in the near future

Keywords

encapsulation; inspection; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; large scale integration; 3D stacked LSI structure; bonding process; layered microthin encapsulation; micro interconnection; microbumping; nondestructive inspection; packaging technology; Bonding processes; Copper; Electrodes; Electronics packaging; Encapsulation; Etching; Gold; Large scale integration; Packaging machines; Stacking;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927748

Filename

927748