Testing Interface Thermal Resistance

Author

Rencz, Márta

Author_Institution

Budapest Univ. of Technol. & Econ., Budapest

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

272

Lastpage

277

Abstract

The paper presents some recent trends in TIM material development, and outlines the state of the art in testing interface thermal resistance values. After presenting the trends in TIM material development first the available experimental techniques are presented shortly, and then the currently available industrial methods are discussed with more details. The paper finally presents some promising developments in finding better resolution high throughput methods to solve the challenging problem of measuring very small thermal resistance values in electronics applications.

Keywords

integrated circuit packaging; materials testing; thermal management (packaging); thermal resistance measurement; TIM material; electronics applications; electronics packages; heat dissipation; interface thermal resistance testing; material testing; miniaturization; semiconductor packages; Conducting materials; Electronic packaging thermal management; Heat transfer; Integrated circuit packaging; Materials testing; Resistance heating; Semiconductor materials; Thermal conductivity; Thermal factors; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Conference_Location

Singapore

Print_ISBN

978-1-4244-1323-2

Electronic_ISBN

978-1-4244-1323-2

Type

conf

DOI

10.1109/EPTC.2007.4469842

Filename

4469842