DocumentCode
3163084
Title
Development of 3-dimensional module package, “System Block Module”
Author
Imoto, Takashi ; Matsui, Mikio ; Takubo, Chiaki ; Akejima, Shuzo ; Kariya, Takashi ; Nishikawa, Tatsuya ; Enomoto, Ryo
Author_Institution
Dept. of Adv. Packaging Eng., Toshiba Corp., Kawasaki, Japan
fYear
2001
fDate
2001
Firstpage
552
Lastpage
557
Abstract
As the mobile electronics equipment moves toward higher performance and miniaturizing, each IC package is required to be stacked for saving a package mounting area on a system board. This paper describes a newly developed 3-dimensional module package using the technology of the silicon device thinning, micro flip chip bonding and two types of via connection of print circuit board for vertical wirings. These technology has realized the high density packaging of over 4 ICs stacking for practical use
Keywords
flip-flops; integrated circuit packaging; modules; IC package; Si; System Block Module; micro flip chip bonding; mobile electronic equipment; print circuit board; silicon device thinning; three-dimensional module package; vertical wiring; via connection; Bonding; Electronic equipment; Electronics packaging; Flip chip; Integrated circuit packaging; Packaging machines; Printed circuits; Silicon devices; Stacking; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location
Orlando, FL
ISSN
0569-5503
Print_ISBN
0-7803-7038-4
Type
conf
DOI
10.1109/ECTC.2001.927782
Filename
927782
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