DocumentCode
3163099
Title
Interconnects for Buried W-Band MMICs Using Novel System-in-Package Technology
Author
Richter, Marius D. ; Becker, Karl-F ; Böttcher, Lars ; Schneider, Martin
Author_Institution
Dept. of RF & Microwave Eng., Univ. of Bremen, Bremen
fYear
2009
fDate
16-18 March 2009
Firstpage
1
Lastpage
4
Abstract
A novel system-in-package technology has been developed which enables to bury active 77 GHz chips inside a printed circuit board (PCB). The chips are connected to an RF substrate on top of the PCB using microvias. To evaluate the performance of these interconnects, silicon daisy chain chips with coplanar lines are buried inside a PCB. Simulation and measurement data are compared. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.
Keywords
MMIC; integrated circuit interconnections; printed circuits; system-in-package; PCB; buried W-Band MMICs; coplanar lines; embedding technology; frequency 77 GHz; interconnects; microvias; printed circuit board; silicon daisy chain chips; system-in-package technology; Bonding; Costs; Drilling; Integrated circuit interconnections; MMICs; Printed circuits; Radio frequency; Substrates; Wire; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2009 German
Conference_Location
Munich
Print_ISBN
978-3-9812668-0-1
Electronic_ISBN
978-3-8007-3150-3
Type
conf
DOI
10.1109/GEMIC.2009.4815915
Filename
4815915
Link To Document