DocumentCode
3163104
Title
Transient electro-thermal analysis of single-walled carbon nanotube (SWCNT) with transmission line model
Author
Yu, Lei ; Tang, Min ; Mao, Junfa
Author_Institution
Dept. of Electron. Eng., Shanghai Jiao Tong Univ., Shanghai, China
fYear
2009
fDate
7-10 Dec. 2009
Firstpage
563
Lastpage
566
Abstract
Transient analysis of electro-thermal coupling of metallic single-walled carbon nanotube (SWCNT) interconnect is performed in this paper using a transmission line model. The SWCNT interconnect is excited by an electro-static discharge (ESD) current pulse. Based on the Luttinger model, the transmission-line equation and heat conduction equation of long SWCNT interconnect are solved iteratively by means of the finite-difference time-domain (FDTD) method. The transient thermal response is evaluated and compared with previous known results. In addition, the impacts of the diameter of SWCNT and the amplitude of ESD pulse on the thermal transient response are also investigated. The results indicate that in order to predict the accurate electro-thermal coupling of SWCNT for the use of future long CNT-based interconnects, special attention should be paid to the transmission line effects.
Keywords
carbon nanotubes; electrostatic discharge; finite difference time-domain analysis; thermal analysis; transient response; transmission line theory; ESD current pulse; FDTD method; Luttinger model; SWCNT; electro-static discharge current pulse; electro-thermal coupling; finite-difference time-domain method; heat conduction equation; single-walled carbon nanotube; transient electro-thermal analysis; transmission line model; transmission-line equation; Carbon nanotubes; Couplings; Electrostatic discharge; Equations; Finite difference methods; Power system transients; Time domain analysis; Transient analysis; Transient response; Transmission lines; ESD pulse; FDTD; Single-walled carbon nanotube (SWCNT); electro-thermal coupling;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2009. APMC 2009. Asia Pacific
Conference_Location
Singapore
Print_ISBN
978-1-4244-2801-4
Electronic_ISBN
978-1-4244-2802-1
Type
conf
DOI
10.1109/APMC.2009.5384166
Filename
5384166
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